Authenticity investigation

1. Appearance inspection

We investigate the packaging and terminals with various optical devices.

• Package appearance (Staining, adhesion of foreign matter, scratches, cracks, resin burrs, etc.)
• Terminals (deformation, scratches, uneven plating, etc.)
• Impression display

2. X-ray fluoroscopy

We observe the internal state of electronic equipment using X-rays, which are widely used as a non-destructive analysis method. For semiconductor devices, we use this method to look for foreign matter inside the packaging, deformation of wire bonding, etc. And for electronic parts, we use this method to inspect solder mounting voids and cracks.

• Internal observation of contamination of foreign matter
• Analysis of open-circuit failure such as through holes and pattern disconnection
• Short-circuit failure analysis
• Observation of solder voids
• Observation of wire bonding
• Structural analysis

3. Electrical static measurement

We use a curve tracer for IC static characteristics testing. A curve tracer is a device for measuring the current-voltage (I-V) characteristics of various semiconductor devices such as diodes, transistors, and optoelectronic components. The purpose of non-defective product analysis is to inspect whether the product has the characteristics according to the specifications based on the data sheet, and the purpose of failure analysis is to compare the waveform with the non-defective product and identify the location of the abnormality.

• Diode forward voltage, reverse leakage current, reverse breakdown voltage
• Diode, transistor and MOSFET characteristic evaluation
• Diode, transistor and IC/LSI failure analysis

4. Ultrasonic microscopy

We observe the inside and outside of the target sample by high frequency ultrasound. Ultrasonic waves have the property of being transmitted and reflected at the interfaces of materials with different acoustic impedances, and by analyzing the detected waveforms, it is possible to non-destructively investigate the internal state of parts. In particular, we use it for package delamination inspection of semiconductor devices such as ICs, and inspection of bonding between substances because of its “high reflective sensitivity to air”.

• IC internal delamination inspection
• IC internal delamination inspection and cross-sectional observation
• Underfill void observation, chip junction, surface observation

5. Cross-sectional observation

In the destructive inspection, we create a cross-sectional sample of each part and observe the following in each sample using optics or SEM.

• Terminal abnormalities (scratches, uneven plating, voids, etc.)
• Package abnormality die bonding status (die paste shape, etc.)
• State of die bonding (die paste shape, etc.)
• State of wire bonding (state of formation of intermetallic compounds, etc.)

6. IC opening

We dissolve the package resin of the semiconductor device with chemicals, etc. to expose the semiconductor chip inside. Through improved chemical conditions in combination with the use of laser opening equipment we have been able to reduce the length of chemical immersion realize IC opening with less wire damage. Our laser opening equipment not only reduces damages from the chemicals, but also has high processing position accuracy, making it possible to perform high-precision processing of micro ICs. As we are able to open the package with little or no wire damage, it is possible to observe failure points in failure analysis and test wire bonding in non-defective product analysis.

7. Wire bonding evaluation

After opening the IC, we observe the state of wiring inside the chip and evaluate the state of bonding wire bonding. This is conducted in accordance with MIL-STD-883G method 2011.